The primary technology of the company is a WLCSP process called Metallized Conductor Chip Scale Package (MCSP), which performs all IC packaging steps at the wafer level. The MCSP technology employs a glass sheet as substrate that is attached to a semiconductor wafer to form a redistribution layer directly on the wafer surface. More >

The MCSP product is a true die size package, which is not true of many competing packages. Since only one substrate is required, the package compares favorably with others in thinness and weight. No competing technologies allow for thin-film deposition of passive components in such close proximity to the IC processor. More >

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