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Fabless Assembly. This segment
has similar characteristics and needs as the IC manufacturer segment. There
are over 20 subcontract assemblers providing CSP services to the semiconductor
industry. The primary needs of this segment are for CSP technology and low-cost
substrates.
more >
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Research and Development. This market segment supplies CSP substrates to IC manufacturers and to subcontract assemblers. The primary needs of this segment are low cost, high operating performance, and ease of manufacturing. more>
MCSP