MCSP was formed in 2003 to produce and commercialize company proprietary Wafer-Level Chip Scale Packaging (WLCSP) technology. That year the company was awarded its first patent. In 2004, MCSP filed and was awarded further patents that expanded the company’s product line and intellectual property. Read more >

Glass Formation License

The company provides WLCSP technologies to the semiconductor industry while realizing revenue through licensing its technology. Read more >

Glass-to-Wafer Lamination Process License incorporates the backend process of wafer/substrate attachment, wafer pad and metal trace interconnection, and next level input/output. Read more >

Sub-Contract Assembly

MCSP also offers their services to aid customers in the development of advanced wafer level chip scale-packaging technologies. Our services can encompass complete turn-key solutions or a portion of production & testing done at our facilities.
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