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Company
MCSP was formed in 2003 to simplify manufacturing steps and increase product reliability at the wafer level. That year the company was awarded its first patent. In 2004, MCSP filed and was awarded further patents that expanded the company's product line and intellectual property.
A privately held company headquartered in San Jose, California, with sales and support around the world, MCSP competes in the rapidly expanding global electronic marketplace where its leading-edge technologies continue to increase device complexity, shrink geometries, and reduce product life cycles. To meet this charter, the company continues to focus on comprehensive solutions to simplify manufacturing steps and increase product reliability.
In January, 2006 MCSP was awarded its third patent, a wafer-level hermetic sealing device to address the expanding requirements of military and medical device applications.
MCSP has seen technological advancements grow dramatically as IC designers and the semiconductor industry have requested increased functionality incorporated into a single device, while simultaneously reducing the device size. This key industry need increases in importance as ICs become more complex with smaller dimensions and more stacked layers, and as more complex materials and processes are introduced into the semiconductor manufacturing process. MCSP's technology is designed specifically to address this need.
Today, many of the company's leading edge products have design rules that are 0.25 micron or less which, can combine device functions of numerous components that in previous years would have required vast silicon real-estate and design integration. The company's comprehensive solutions to the rapidly expanding global electronics marketplace provide its customers with a significant competitive edge.
But the most significant MCSP technological innovations
have yet to come. The company is well positioned in major markets to merge
current and future industry requirements into a secured position among the
top tier of major companies. The company is fully committed to meeting the
microelectronics industry's need for extremely high yielding products which
incorporate increased functionality designed into wafer level fabrication
techniques.
About Our Licensing
Licensing Technology
The company provides WLCSP technologies to the semiconductor industry while realizing revenue through licensing its technology. The Glass Formation License is limited to large corporate "sight holders" who have the structure and financial backing for the Glass Substrate Process. This license covers the proprietary via formation, development of the metallized glass substrate, passive component thin-film and thick-film deposition, and testing capability.
Glass-to-Wafer Lamination Process License incorporates the backend process of wafer/substrate attachment, wafer pad and metal trace interconnection, and next level input/output. Glass-to-Wafer technology licenses include a nominal license purchase fee plus royalties. These licenses are targeted for IC manufacturers, subcontract assemblers, and substrate suppliers. Non-Recurring Engineering Charge (NRE) is charged for packaging development services, which include glass substrate design, prototype development, and qualification. At production, the customer is charged a price, based on volume, for each wafer assembled into packages.
Other Services
MCSP also offers their services to aid customers in the development of advanced wafer level chip scale-packaging technologies. Our services can encompass complete turn-key solutions or a portion of production & testing done at our facilities. Our strong technical and manufacturing background provides unrevealed advantages for R&D, small runs and economies of scale production assemblies.
Rapid Turn Design and Fabrication
Volume Testing
Low-Cost Packaging
Quality-Driven Operations
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