Micro-Chip Scale Packaging (MCSP) competes in the rapidly expanding global electronic marketplace where its leading-edge technologies continue to increase device complexity, shrink geometries, and reduce product life cycles.To meet this charter, the company continues to focus on comprehensive solutions to simplify manufacturing steps and increase product reliability. More >

MCSP technology employs a glass sheet as substrate that is attached to a semiconductor wafer to form a redistribution layer directly on the wafer surface. The reduction of IC packaging steps from the traditional front and back-end processes to the wafer level significantly reduces production costs and improves yield. More >